Description

Thermalright M1 Thermal Paste – High Performance CPU & GPU Thermal Compound

Product description

The Thermalright M1 Thermal Paste is a high-performance thermal interface material designed to efficiently transfer heat from CPUs, GPUs, and other heat-generating components to their cooling solutions. With a 12.9 W/m·K thermal conductivity, M1 helps improve heat transfer between the chip and heatsink or cooler, supporting effective thermal management during gaming, demanding workloads, and everyday PC operation. It is available in 2.5g, 4.5g, 6.5g, and 8.5g quantities, allowing users to select the amount suited to their build or repasting requirements.

Thermalright M1 is electrically non-conductive, making it safer to use around electronic components because the thermal compound does not conduct electricity. Its high thermal conductivity and non-conductive formulation make it suitable for CPU and GPU cooling applications where reliable heat transfer is required. The available 2.5g, 4.5g, 6.5g, and 8.5g options also provide flexibility for individual repasting or multiple applications.

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